nichia sts-da1-1286 nichia corporation specifications for amber led NSPA510BS rohs compliant
nichia sts-da1-1286 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 30 ma pulse forward current i fp 100 ma reverse voltage v r 5 v power dissipation p d 103 mw operating temperature t opr -30 85 c storage temperature t stg -40 100 c junction temperature t j 100 c * absolute maximum ratings at t a =25c. * i fp conditions with pulse width 10 ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ. unit forward voltage v f i f =20ma 3.1 v luminous intensity i v i f =20ma 7.8 cd x - i f =20ma 0.560 - chromaticity coordinate y - i f =20ma 0.435 - * characteristics at t a =25c. * luminous intensity value is traceable to the cie 127:2007-compliant national standards. * the chromaticity coordinates are derived from the cie 1931 chromaticity diagram.
nichia sts-da1-1286 2 ranks item rank min. max. unit forward voltage - 2.65 3.45 v reverse current - - 50 a u 8.4 11.8 t 5.9 8.4 luminous intensity s 4.2 5.9 cd color rank rank l x 0.603 0.532 0.522 0.589 y 0.397 0.467 0.460 0.393 * ranking at t a =25c. * reverse current at v r =5v. * tolerance of measurements of the forward voltage is 0.05v. * tolerance of measurements of the luminous intensity is 10%. * tolerance of measurements of the chromaticity coordinate is 0.01. * basically, a shipment shall consist of the leds of a comb ination of the above ranks. the percentage of each rank in the shipment shall be determined by nichia.
nichia sts-da1-1286 3 chromaticity diagram 585 595 600 590 580 l 0.30 0.35 0.40 0.45 0.50 0.45 0.50 0.55 0.60 0.65 x y
nichia sts-da1-1286 4 outline dimensions sts-da7-0046 nspa51 0bs ? no. ( g unit: mm) t his product complies with rohs directive. u? roh s ?m??? * ( g unit: mm, tolerance: 0.2) ???`? lead standoff 1 0.3 0.3 ? item ?| resin materials `??` | lead frame materials | weight description ?? ( ?w ) epoxy resin (partly using phosphor) + y? + U?`?? ag-plated and lead-free solder-plated iron 0.26g (typ) ? led ??? ??`???? ????QH???? `??????? * the tie bar cut-end surface exhibits exposed iron base metal. care must be taken to handle the leds, as it may contain sharp parts such as lead, and can cause injury. * ?????????? no noticeable exposure of base metal of the lead with a solder-dipped finish. 5.6 (2) 1 (2.5) 5 5.3 7.3 8.3 12.10.5 28.61 1.1 1.5 max not soldered anode cathode 0.5 +0.1 - 0.05
nichia sts-da1-1286 5 soldering ? hand soldering temperature 350c max. soldering time 3 sec. max. position no closer than 3mm from the base of the lens. ? dip soldering pre-heat 120c max. pre-heat time 60 sec. max. solder bath temperature 260c max. dipping time 10 sec.max dipping position no closer than 3mm from the base of the lens. * solder the led no closer than 3 mm from the base of the le ns. soldering beyond the base of the tie bar is recommended. * dip soldering and manual sold ering must only be done once. * a rapid-rate process is not recommended for cooling the leds down from the peak temperature. * do not apply any stress to th e lead particularly when heated. * after soldering, the led position must not be corrected. * after soldering, no mechanical shock or vibration should be applied to led lens until the leds cool down to room temperature. * in order to avoid damage on the lens during cutting an d clinching the leads, it is not recommended to solder the leds directly on customer pcb without any gap between the lens and the boar d. if it is unavoidable, customer is advised to check whether such solder ing will not cause wire br eakage or lens damage. direct soldering to double-sided pcbs must be avoided due to an in creased effect of heat on the lens. * when it is necessary to clamp the leds to prevent solderin g failure, it is important to minimize the mechanical stress on the leds. * cut the led lead frames at room temperature. cutting the le ad frames at high temperature may cause failure of the leds.
nichia sts-da1-1286 6 packaging - bulk ? label attached to the box ? label printed on the bag sts-da7-0001 nxxxxxxxx do not drop the cardboard box or expose it to shoc k. if the box falls, the products could be damaged. the cardboard box is not water-resistant. do not expose to water. customer is advised to pack the products in the original packaging or equivalent in transit. ?`???????y?????? * ??\H?y?B???y? * ?QH??n?????u?p?????? * the products are placed lo ose in anti-static bags. the anti-static bags are packed in cardboard boxes to prevent damage during shipment. * u???????n?go??`y? ? for details, see "lot numbering scheme" in this document. * ??????????? if not provided, it is not indicated on the label. ******* is the customer part number. O??????? * ******* ?? ? no. rohs nxxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan rohs nxxxxxxxx ******* xxxx led caution to electrostatic damage ??? nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty pcs ymxxxx-rrr anti-electrostatic bag ?? nichia led ??K???`? the anti-electrostatic bags are packed in a cardboard box with corrugated partition.
nichia sts-da1-1286 7 lot numbering scheme lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous intensity
nichia sts-da1-1286 8 derating characteristics sts-da7-0101 ? no. nspa510b(s) derating1 0 10 20 30 40 50 0 20406080100120 (47, 30.0) (85, 8.5 0) dut y 10 100 1000 1 10 100 30 S all owa bl e f orwar d c urr ent ( m a) ?? - S ambient temperature vs allowable forward current S allowable forward curr ent (ma) ?? ambient temperature (c) ?` ?` duty ratio (%) ?`?` S duty ratio vs allowable forward current t a = 25c
nichia sts-da1-1286 9 optical characteristics nspa510b(s) ? no. sts-da7-0102 spectrum 0.0 0.2 0.4 0.6 0.8 1.0 4 00 450 5 00 550 600 650 700 750 800 relative luminosity ( a.u .) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -20 -3 0 -40 -50 -60 -70 -8 0 -90 k??? spectrum k? relative emission intensity (a.u.) L wavelength (nm) ? directivity ? radiation angle 10.500.5 1 20 ma i fp = t a = 25c 20 ma i f = t a = 25c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts-da1-1286 10 forward current characteristics / temperature characteristics nspa510b(s) sts-da7-0103 ? no. tavf 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -60 -40 -2 0 0 20 40 60 80 10 0 120 ta iv 0.6 0.8 1.0 1.2 1.4 -60 -40 -2 0 0 20 40 60 80 1 00 120 vfif 1 10 10 0 2.02.53.03.54.04.55.0 20 relative luminosity (a.u.) ?? - ambient temperature vs relative luminosity for ward curren t (m a) ifiv 0 1 2 3 4 5 0 20406080100120 relative luminosity (a.u.) - forward current vs relative luminosity for ward current (m a) ?R - forward voltage vs forward current ?? - ?R ambient temperature vs forward voltage ?R for ward volta g e (v) ?R forward voltage (v) ?? ambient tem p erature ( c ) ?? ambient temperature (c) i fp = 20 ma i fp = 60 ma i fp = 5 ma t a = 25c t a = 25c * ??? all characteristics shown are for reference only and are not guaranteed. i fp = 20 ma
nichia sts-da1-1286 11 forward current characteristics / temperature characteristics ? no. nspa510b(s) sts-da7-0104 taxy 0.42 5 0.43 0 0.43 5 0.44 0 0.44 5 0.5 50 0.55 5 0.560 0.565 0.570 -30 c 0c 25c 50c 85c x ifxy 0.42 5 0.43 0 0.43 5 0.44 0 0.44 5 0.550 0 .5 55 0.5 60 0.565 0.570 1 ma 20 ma 100 ma x y y 20 ma i fp = ?? - ? ambie nt te mperature vs chromaticity c oordinate - ? forward current vs chromaticity c oordinate t a = 25c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts-da1-1286 12 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # unites failed/tested resistance to soldering heat jeita ed-4701 300 302 t sld = 260 5c, 10 sec, 1 dip, 3 mm from the base of the lens #1 0/50 temperature cycle jeita ed-4701 100 105 -40c (30 min) ~ 25c (5 min) ~ 100c (30 min) ~ 25c (5 min) 100 cycles #1 0/50 moisture resistance (cyclic) jeita ed-4701 200 203 25c ~ 65c ~ -10c, 90%rh, 24 hr per cycle 10 cycles #1 0/50 terminal bending strength jeita ed-4701 400 401 5 n, 0 ~ 90 ~ 0 bend, 2 bending cycles #1 0/50 terminal pull strength jeita ed-4701 400 401 10 n, 10 1 sec #1 0/50 high temperature storage jeita ed-4701 200 201 t a =100c 1000 hours #1 0/50 temperature humidity storage jeita ed-4701 100 103 t a =60c rh=90% 1000 hours #1 0/50 low temperature storage jeita ed-4701 200 202 t a =-40c 1000 hours #1 0/50 room temperature operating life t a =25 i f =30ma 1000 hours #1 0/50 temperature humidity operating life 60c rh=90% i f =20ma 500 hours #1 0/50 low temperature operating life t a =-30c i f =20ma 1000 hours #1 0/50 notes: measurements are performed after allowi ng the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage (v f ) i f =20ma > u.s.l.1.1 luminous intensity (iv) i f =20ma < l.s.l.0.7 #1 reverse current (i r ) v r =5v > u.s.l.2.0 u.s.l. : upper specification limit l.s.l. : lower specification limit
nichia sts-da1-1286 13 cautions (1) lead forming when forming leads, the leads should be bent at a point at lease 3mm from the base of the epoxy bulb.do not use the base of the leadframe as a fulcrum during lead forming. lead forming should be done before soldering. do not apply any bending stress to the base of the lead. th e stress to the base may damage the led's characteristics or it may break the leds. when mounting the product onto a printed circuit board, the via-holes on the board should be exactly aligned with the lead pitch of the product.if the leds are mounted with stress at the leads, it caus es deterioration of the epoxy re sin and this will degrade the leds. (2) storage shelf life of the products in unopened bag is 3 months (max.) at <30 c and 70% rh from the delive ry date.if the shelf life exceeds 3 months or more, the leds need to be stored in a sealed container with desiccant (silica gel) to ensure their shelf life will not exceed 1 year. customer is advised to store properly the products in cont rolled ambient and complete imme diately all high temperature related process including soldering as exposure to corrosive environment might caus e the plated metal parts of the product to tarnish, which might le ad to difficulties in soldering. to avoid condensation, the pr oducts must not be stored in the areas where temperature and humidity fluctuate greatly. (3) directions for use in designing a circuit, the current through each led must not exceed the absolute maximum rating specified for each led. it is recommended to use circuit b which regulates the current flowing th rough each led. in the meanwhile, when driving leds with a constant voltage in circuit a, the current through the leds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... this product should be operated in forwar d bias. a driving circuit must be designed so that the product is not subjected to either forward or reverse voltage while it is off. in particular, if a reverse voltage is continuously applied to the produc t, such operation can cause migration resulting in led damage. for stabilizing the led characteristics, it is recommended to operate at 10% of the rated current or higher. care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the leds with matrix drive. for outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. (4) handling precautions when handling the product, do not touch it directly with bare hands as it may contaminate the surface and affect on optical characteristics. in the worst cases, excessive fo rce to the product might result in catastrophic failure due to package damage and/or wire breakage. if the product is dropped, it might be damaged. do not stack assembled pcbs together. fa ilure to comply can cause the resin portio n of the product to be cut, chipped, delaminated and/or deformed, and wire to be br oken, and thus resulting in catastrophic failure. (5) design consideration pcb warpage after mounting the products on to a pcb can cause the package to brake. the leds should be placed so as to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechan ical stress is exerted on the leds placed near the score lines. the leds should be placed so as to minimi ze the stress on the leds due to board flexing. board separation must be performed using special jigs, not with hands.
nichia sts-da1-1286 14 (6) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltag e. an esd event may damage its die or reduce its reliability performance. when handling the products, measures against el ectro static discharge, including the followings, are strongly recommended. eliminating the charge; wrist strap, esd footwear and garments, esd floors grounding the equipment and tools at workstation esd table/shelf mat (conductive materials) proper grounding techniques are required for all devices, eq uipment and machinery used in the assembly of the products. also note that surge protection should be considered in the design of customer products. if tools or equipment contain insulating materials, such as glass or plastic, proper measures against electro static discharge , including the followings, are strongly recommended. dissipating the charge with conductive materials preventing the charge generation with moisture neutralizing the charge with ionizers when performing the characteristics inspection of the leds in your application, customer is advised to check on the leds whether or not they are damaged by esd. such dama ge can be detected during forward voltage measurement or lightup test at low current. (the recommended current is 1ma or lower) esd-damaged leds may have an increased leakage current, curren t flow at low voltage, or no longer light up at low current. failure criteria: vf<2.0v at if=0.5ma (7) thermal management thermal management is an important fact or when designing your product by using the leds. the rise in led die temperature can be affected by pcb thermal resistance or/and led spac ing as mounted on the board. cu stomer is advised to design the product to ensure that the led die temperature do es not exceed the required maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. (8) cleaning if required, isopropyl alcohol (ipa) should be used. othe r solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. ultrasonic cleaning is not recommended for the leds since it may adversely effect on the leds by the ultrasonic power and led assembled condition. if it is unavoidable, custom er is advised to check prior to use that the cleaning will not damage the leds. (9) eye safety the international electrical commission (iec) publis hed in 2006, iec 62471:2006 photobiological safety of lamps and lamp systems which includes leds within its scope. meanwhile leds were removed from the scope of the iec 60825-1:2007 laser safety standard, the 2001 edition of which included led sources within its scope. however, keep it mind that some countries and regi ons have adopted standards based on the iec laser safety standard iec 60825-1:2001 which includes le ds within its scope. following iec 62471:2006, most of nichia leds can be classified as be longing to either exempt group or risk group 1. especially a high-power led, that emits light containing blue wavelengths, may be in risk group 2. great care should be taken when viewing directly the led driven at high current or the led with optical instruments, which greatly increase the hazard to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, precaution should be taken to avoid adverse e ffect on human body caused by the light stimulus.
nichia sts-da1-1286 15 (10) others the leds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuclear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. customer and nichia shall agree the official specification of supplied products prior to the st art of a customer?s volume prod uction. the appearance and specifications of the produc t may be modified for improvement without notice.
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